F4BTMS430 2-Layer PCB: High-Performance Construction for Aerospace Applications
1.PCB Construction Details
| Specification | Details |
|---|---|
| Base Material | F4BTMS430 |
| Layer Count | 2 layers |
| Board Dimensions | 89.59mm x 70.83mm (1 PCS, +/- 0.15mm) |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | None |
| Finished Board Thickness | 3.2mm |
| Finished Cu Weight | 1oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20 µm |
| Surface Finish | Hot Air Soldering Level (HASL) |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | Black |
| Bottom Solder Mask | None |
| Electrical Testing | 100% electrical test prior to shipment |
2. PCB STACKUP
| Layer | Thickness |
|---|---|
| Copper Layer 1 | 35 µm |
| F4BTMS430 Core | 3.175 mm (125 mil) |
| Copper Layer 2 | 35 µm |
3. PCB STATISTICS
Components: 18
Total Pads: 51
Thru Hole Pads: 27
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 31
Nets: 2
4.ARTWORK AND QUALITY
Type of Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
5. Introduction to F4BTMS
The F4BTMS series is an advanced version of the F4BTM series, showcasing significant improvements in material formulation and manufacturing processes. Enhanced with ceramics and ultra-thin glass fiber cloth, this high-reliability material is ideal for aerospace applications, offering a viable alternative to foreign products.
By integrating special nano-ceramics with polytetrafluoroethylene resin, it minimizes the negative effects of glass fiber on electromagnetic wave propagation, resulting in reduced dielectric loss and increased dimensional stability. The material supports a wider frequency range, improved electrical strength, and enhanced thermal conductivity, while maintaining a low thermal expansion coefficient.
The F4BTMS430 features RTF low roughness copper foil, which minimizes conductor loss and maximizes peel strength, suitable for both copper and aluminum bases.
6. Features of F4BTMS430
Dielectric Constant (Dk): 4.3 at 10GHz
Dissipation Factor: 0.0015 at 10GHz, 0.0019 at 20GHz
CTE x-axis: 13 ppm/°C, y-axis: 12 ppm/°C, z-axis: 47 ppm/°C (−55°C to 288°C)
Low Thermal Coefficient of Dk: -60 ppm/°C (−55°C to 150°C)
High Thermal Conductivity: 0.63 W/mk
Low Moisture Absorption: 0.08%
7.Typical Applications
Aerospace equipment and cabin systems
Microwave and RF technologiesB
Radar systems, including military applications
Feed networks and phased array antennas
Satellite communications and more.